High-Temperature Tunnel Oven (Vacuum Reflow Type)

The high-temperature tunnel oven (reflow type) is a continuous vacuum reflow system designed for precision soldering and high-temperature thermal processing. It integrates infrared heating, forced hot air circulation, and vacuum technology to ensure stable temperature profiles, low void rates, and high product reliability. The system is suitable for cleanroom environments and high-end electronic manufacturing.

Applications

Reflow soldering for electronic assemblies

Semiconductor and IC packaging

PCB and hybrid circuit processing

Optical and LCD module manufacturing

Precision components requiring high-temperature and clean processing

Technical Specifications

Features

Vacuum Reflow Capability: Reduces solder voids and improves joint reliability

High-Temperature Performance: Supports processes up to 350°C

Uniform Heating Design: Top-down hot air circulation ensures even temperature distribution

Fast Thermal Response: Medium-wave quartz heaters enable rapid heating

Cleanroom Construction: Fully welded SUS304 chamber minimizes particle generation

Stable Conveyor System: Roller-supported belt prevents vibration and product damage

Precision Control System: OMRON PID controller with SSR ensures accurate temperature regulation

Advanced Automation: Siemens PLC and HMI support MES integration

Real-time Temperature Monitoring: Multi-point recording with USB data export

Comprehensive Safety Protection: Includes phase protection, overload, emergency stop, and over-temperature protection

FAQ

1. What is the difference between a reflow tunnel oven and a standard oven?

A reflow tunnel oven includes controlled temperature profiles and optional vacuum functionality, making it suitable for soldering processes with higher precision requirements.

2. Why is vacuum used in reflow ovens?

Vacuum removes trapped gases during soldering, significantly reducing voids and improving electrical and mechanical reliability.

3. Is this equipment suitable for cleanroom production?

Yes, it meets Class 100 cleanliness requirements with low particle generation design.

4. How is temperature consistency ensured?

Through optimized airflow design, PID temperature control, and multi-point real-time monitoring.

5. Can the system be integrated into automated production lines?

Yes, it supports PLC control and MES system integration for full automation and traceability.