Photoresist Curing Tunnel Furnace

A photoresist curing tunnel furnace is a continuous thermal processing equipment specially designed for photoresist processes in semiconductor manufacturing, panel display (LCD/OLED) production, and PCB manufacturing.It is used for pre-bake after photoresist coating, hard-bake, and curing treatment after development. Through precise temperature control and a high-cleanliness environment, the equipment ensures stable performance of the photoresist layer and improves the yield of pattern transfer.

Product Applications

Pre-bake Process:

Remove solvents from the photoresist.

Hard-bake Process:

Improve the etching resistance of the photoresist.

Post-development Curing:

Enhance the adhesion between the photoresist and the substrate.

Stress Release:

Eliminate mechanical stress inside the photoresist layer.

Product Parameters

Product Features

Efficient Continuous Operation:

The tunnel structure enables uninterrupted assembly line production.

Precision Temperature Control:

Multi-zone independent PID control ensures a smooth temperature curve.

High Cleanliness:

Built-in high-efficiency particulate air filter (HEPA) and laminar flow circulation design provide a high-cleanliness processing environment.

Nitrogen Protection:

Supports nitrogen-filled low-oxygen operation to prevent photoresist oxidation.

Intelligent Control:

PLC combined with a touch screen supports storage of process parameter recipes.

FAQ

Q1: How is the cleanliness level of this tunnel furnace guaranteed?

A1: The chamber adopts fully sealed welding construction and is equipped with high-temperature high-efficiency particulate air filters (HEPA). Combined with a precision laminar flow circulation air duct design, it ensures that the working area reaches Class 100 cleanliness level or higher.

Q2: How can photoresist oxidation be prevented during the baking process?

A2: The equipment is equipped with a nitrogen (N₂) filling system and an oxygen concentration analyzer. By continuously injecting high-purity nitrogen into the furnace chamber, the oxygen concentration is reduced to an extremely low level, effectively preventing photoresist oxidation.

Q3: How can the baking process be adjusted for photoresists with different thicknesses?

A3: The preset temperature of each heating zone and the conveyor belt running speed can be adjusted through the control panel. By modifying the "temperature-time" curve, the curing requirements of photoresists with different thicknesses can be achieved.

Q4: How does the equipment ensure that temperatures between different zones do not interfere with each other?

A4: Physical heat insulation curtains or air curtain isolation zones are installed between each temperature zone. Combined with independent exhaust and ventilation systems, each temperature zone maintains independent temperature control without mutual interference.

Q5: How are the volatilized photoresist solvents handled?

A5: A dedicated exhaust interface is designed on the top of the equipment. The organic solvent gases generated during the baking process are quickly extracted and connected to the factory’s exhaust gas treatment system to ensure safe operation.