Osaka Type Thermal Stress Tester

Standards:

IEC 60068-2-14 MIL-STD-883 Method 1010 JESD22-A104 JASO-D902 IPC-TM-650

The Osaka Type Thermal Stress Tester simulates the thermal stresses that materials and components experience in real-world applications subject to temperature fluctuations. This is crucial for evaluating product reliability and lifespan. The instrument typically consists of one or more temperature-controlled chambers capable of rapidly changing the temperature of the test specimens. Depending on the specific "Osaka Type" method, this might involve a single chamber that ramps temperature up and down (thermal cycling) or a system with separate hot and cold chambers between which samples are rapidly transferred (thermal shock). The repeated expansion and contraction caused by these temperature changes can reveal material defects, solder joint fatigue, delamination, cracking, or changes in electrical or mechanical properties. The test is vital for quality assurance, research and development, and failure analysis in industries where components are exposed to varying thermal environments.

Application:

Electronic components and assemblies (e.g., integrated circuits, circuit boards, connectors)

Automotive parts and systems

Aerospace components and materials

Coatings and surface treatments

Plastics and polymers

Adhesives and sealants

Product Advantages:

Simulates Real-World Thermal Stress: Replicates the damaging effects of temperature fluctuations experienced by products in service.

Identifies Potential Failure Modes: Helps reveal weaknesses such as cracking, delamination, or material degradation caused by thermal expansion mismatches.

Accelerated Testing: Provides a means to accelerate the aging process and predict long-term reliability in a shorter timeframe.

Objective Evaluation: Allows for quantifiable assessment of material and component performance after thermal stress.

Standard Compliant: Designed to perform tests according to various recognized international thermal testing standards.

Controllable Test Parameters: Enables precise control over temperature ranges, dwell times, transition rates, and number of cycles.

Product Features:

Environmental test chamber(s) capable of achieving and maintaining precise high and low temperatures.

Heating and cooling systems (e.g., mechanical refrigeration, LN2 or LCO2 cooling).

Air circulation system within the chamber(s) for uniform temperature distribution.

Programmable control system for defining test cycles (number of cycles, temperature setpoints, dwell times at high/low temperatures, transition times).

Rapid temperature change capability for inducing thermal shock or fast thermal cycling.

Sample holders or baskets designed to accommodate test specimens and allow for efficient temperature transfer.

Data logging capabilities to monitor temperature profiles during testing.

Safety features such as over-temperature protection and door interlocks.

(For two-zone thermal shock testers) Mechanism for rapid transfer of the sample basket between hot and cold chambers (e.g., elevator system).

(Potentially for "Osaka Type") Specific chamber dimensions, airflow patterns, or sample mounting configurations.